UCON Solder Assist Fluid 25 - 上海旭化贸易有限公司

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UCON Solder Assist Fluid 25

Product

Description

UCON™ Solder Assist Fluid 25 is a low viscosity, water soluble polyalkylene glycol fluid with excellent thermal stability. It is designed for use in solder reflow fluids, fluxes, fusing fluids, and other process fluids where high temperature stability and water washability are

critical. Solder Assist Fluid 25 does not contain any additives which could be deposited on the circuit board during aqueous cleaning procedures.

UCON Solder Assist Fluid 26 is based on the same polyalkylene glycol polymer as Solder Assist Fluid 25. It differs from Solder Assist Fluid 25 in that it has been formulated with a proprietary additive package to further improve the product’s stability at high temperatures and to raise its flash point.

Product Features

• Good Thermal Stability

• High Flash Point

• Excellent Water Washability

• Low Foam Tendency

• Biodegradable, Low Toxicity

• Low Odor

• High Product Clarity

SAF-25 and SAF-26 have been found particularly useful in various heat transfer andblanketing applications. They are used to fuse Sn-Pb electroplate into solder-coating duringfabrication and to “reflow” solder-coat and solder preform in assembly operations. Solder Assist Fluids 25 and 26 are also used as hot liquid leveling fluids to smooth solder coatingsand clear plated through-holes, and as blanketing fluids to protect liquid solder from oxidizing.

Typical Physical Properties

Property SAF-25 SAF-26

Viscosity (cSt at 40°C) 90 90

(cSt at 100°C) 12 12

Specific Gravity (20/20°C) 1.151 1.152

Density (lbs/gal, 68°F) 9.57 9.59

(g/cm3, 20°C) 1.15 1.15

Pour Point (°F) -29 <-30

(°C) -33.9 <-34

Flash Point, closed cup (°F) 360 535

(°C) 182 279

open cup (°F) 535 590

(°C) 279 310

Surface Tension (dynes/cm) 37.8 38.1

Water Solubility (25°C) complete complete*

Cloud Point (°F) >210 >210*

(°C) >99 >99*

(temperature above which a 1% aqueous

solution of the product separates)

†Typical properties, not to be construed as specifications

*Product contains small amounts of water-insoluble additives which are present to improve thermal stability

Product

Stewardship

Dow encourages its customers and potential users to review their applications from the

standpoint of human health and environmental aspects. To help ensure that Dow products

are not used in ways for which they are not intended or tested, Dow personnel will assist

customers in dealing with environmental and product safety considerations. Dow literature,

including Material Safety Data Sheets, should be consulted prior to the use.